[1]张宁,张春红,付健,等.钎焊温度对Sn58Bi-1.5Al2O3/Cu微焊点组织及性能的影响[J].徐州工程学院学报(自然科学版),2017,(2):77-81.
 ZHANG Ning,ZHANG Chunhong,FU Jian,et al.Effect of the Soldering Temperature on the Structure and Properties of Sn58Bi-1.5Al2O3 Micro Solder Joint[J].Journal of Xuzhou Institute of Technology(Natural Sciences Edition),2017,(2):77-81.
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钎焊温度对Sn58Bi-1.5Al2O3/Cu微焊点组织及性能的影响()
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《徐州工程学院学报》(自然科学版)[ISSN:1674-358X/CN:32-1789/N]

卷:
期数:
2017年第2期
页码:
77-81
栏目:
工程技术
出版日期:
2017-04-28

文章信息/Info

Title:
Effect of the Soldering Temperature on the Structure and Properties of Sn58Bi-1.5Al2O3 Micro Solder Joint
文章编号:
1674-358X(2017)02-0077-05
作者:
张宁1张春红2付健1倪琪1张信永2
1.徐州工程学院 江苏省工程机械检测与控制重点实验室,江苏 徐州 221018; 2.徐州生物工程职业技术学院 机电工程系,江苏 徐州 221006
Author(s):
ZHANG Ning1 ZHANG Chunhong2 FU Jian1 NI Qi1 ZHANG Xinyong2
1.Jiangsu Key Laboratory of Engineering Machinery Detection and Control, Xuzhou University of Technology, Xuzhou 221018, China; 2.Department of Mechanical & Electrical Engineering, Xuzhou Bioengineering Technical College, Xuzhou 221006, China
关键词:
钎焊温度 SnBi 高温时效 界面组织 力学性能
Keywords:
soldering temperature SnBi high temperature aging interface organization mechanical properties
分类号:
TG454
文献标志码:
A
摘要:
采用超声协振复合钎焊新技术制备Cu/Sn58Bi-1.5Al2O3/Cu微焊点,通过微观组织观察、显微硬度测试和拉伸性能检测,综合评定钎焊温度对焊点组织和性能的影响.研究结果表明:随着钎焊温度从200、220、240 ℃逐步提高到260 ℃,钎料合金的组织粗化,细小的点状过渡到层片状,Bi相面积占比也从56.73%逐步提高到62.66%; 并且界面IMC层厚度逐步变厚,在90 ℃经高温时效100 h后,IMC的形貌也由原来的扇贝状变为明显的块状,单一的Cu6Sn5薄层也增厚为Cu6Sn5和Cu3Sn两层界面; 复合钎料合金的显微硬度逐步提高,而焊点的拉伸强度则逐步下降,且高温时效后比时效前下降的幅度更为明显,钎焊温度越高,高温时效对抗拉强度的影响越大,焊点的可靠性越低.
Abstract:
New ultrasonic-assisted soldering technology was adopted to weld Cu/Sn58Bi-1.5Al2O3/Cu mini butt joints.Through microstructure observation,micro hardness experiment,and tensile test to evaluate comprehensively the effect of soldering temperature on the microstructure and properties of solder joint.The results show that with the soldering temperature from 200 ℃,220 ℃,240 ℃ to 260 ℃,the microstructure of soldering alloy coarsened, the small pods transited to lamellar structure, and the proportion of Bi phase area also gradually increased from 56.73% to 62.66%.The thickness of the interface IMC layer gradually thickened, after aging at 90 ℃ for 100 hours,the shape of the IMC also changed from the original scallop to the obvious block,and the single Cu6Sn5 thin layer is also thickened to two layers of Cu6Sn5 and Cu3Sn phases.The micro hardness of the composite solder alloy gradually increased,while the tensile strength of the solder joint gradually decreased,and the decline after the high temperature aging is more obvious than the pre aging.The higher the soldering temperature, the greater the influence of high temperature aging on tensile strength, and the lower the reliability of solder joints was.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2017-03-31 基金项目:江苏省高校自然科学研究面上项目(15KJB430030); 江苏省第五期“333工程”第三层次培养资金资助项目; 江苏省大型工程装备检测与控制重点建设实验室开放课题(JSKLEDC201510); 徐州市科技计划项目(KC15SM041); 徐州工程学院科研培育项目(XKY2016118); 徐州生物工程职业技术学院科技计划项目(2015KY02) 作者简介:张 宁(1980-),男,讲师,博士,主要从事钎焊材料和金属基复合材料研究.
更新日期/Last Update: 1900-01-01